
The TC Wafer Wafer Temperature Measurement System embeds high-temperature resistant thermocouple sensors on the wafer surface using independently developed core technologies, enabling real-time monitoring and recording of temperature change data during the wafer manufacturing process. It provides an efficient and reliable method for monitoring and optimizing key process parameters in semiconductor manufacturing.
| Wafer Size | 2", 3", 4", 6", 8", 12" | Wafer Material | Silicon Wafer/Sapphire, etc. |
|---|---|---|---|
| Number of Temperature Measurement Points | 1-34 | Wire Length | L1-Internal Cavity; L2-Chamber Door Transition Section; L3-External Cavity |
| Temperature Sensing Element | TC | Sampling Frequency | 1Hz |
| TC Wire Diameter | 0.127mm/0.254mm | Supporting Host | Temperature Measurement System Host |
| Temperature Range | K-type: RT~1200°C; R/S-type: RT~1200°C; T-type: RT~350°C; TR High-precision Type: -40-250°C / -40-350°C | ||
| Temperature Accuracy | K-type: +1.1°C/0.4%; R/S-type: ±0.6°C/0.1%; T-type: 0.5°C; TR High-precision Type: 0.1°C/+0.5°C | ||
| Temperature Measurement Software | Specialized software for real-time display of temperature field profiles and heating curves | ||